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Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/189219
Kind Code:
A1
Abstract:
Provided are the following: a curable resin composition which exhibits excellent B-HAST resistance and PCT resistance while ensuring excellent reliability as a rigid cured product having excellent TCT resistance; and a dry film, a cured product and a printed wiring board obtained using the curable resin composition. The present invention is: a curable resin composition which contains (A) a carboxyl group-containing resin, (B) an epoxy resin having a dicyclopentadiene skeleton, (C) a photopolymerization initiator, and (D) spherical silica, with the content of the spherical silica (D) being 50 mass% or more relative to non-volatile components in the composition; and a dry film, a cured product and a printed wiring board obtained using the curable resin composition.

Inventors:
KITAMURA TARO (JP)
YODA TAKESHI (JP)
OKAYASU KATSUKI (JP)
TAKII YOJI (JP)
ITO NOBUHITO (JP)
Application Number:
PCT/JP2019/012933
Publication Date:
October 03, 2019
Filing Date:
March 26, 2019
Export Citation:
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Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
C08G59/20; C08F290/14; C08G59/16; C08K3/36; C08K7/18; C08L63/00; C08L101/08; G03F7/004; G03F7/032; G03F7/038; H05K3/28
Domestic Patent References:
WO2013172433A12013-11-21
WO2015190210A12015-12-17
Foreign References:
JPH1022641A1998-01-23
JP2003252960A2003-09-10
JP2014156514A2014-08-28
JP2012190924A2012-10-04
JP2006251007A2006-09-21
JP2007258508A2007-10-04
JP2005191069A2005-07-14
JP2001015934A2001-01-19
JPH11189712A1999-07-13
JP2006073982A2006-03-16
JP2009235217A2009-10-15
JP2010028087A2010-02-04
JP2012158653A2012-08-23
US20110048776A12011-03-03
US20100056671A12010-03-04
Attorney, Agent or Firm:
HONDA Ichiro (JP)
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