Title:
CURABLE RESIN COMPOSITION, DRY FILM, CURED ARTICLE, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2020/129381
Kind Code:
A1
Abstract:
[Problem] To provide a curable resin composition having such a property that air bubbles generated in a film of the curable resin composition applied onto a substate can escape from the film easily and also having excellent heat resistance, dryability, electroless gold plating properties, heat resistance, flexibility and bending properties. [Solution] A curable resin composition comprising (A) an alkali-soluble resin, (B) a photopolymerization initiator, (C) a compound having two ethylenically unsaturated groups and having a molecular weight of 300 to 1000, and (D) a heat-curable component, wherein, when 0.2 ml of the curable resin composition is intercalated between two stainless steel sheet sensors each having a diameter of 35 mm, then the resultant product is allowed to leave at 25°C for 60 seconds, and then a share stress of 0.0001 Pa is changed to a stress of 1.0 E + 4 Pa, the amount of change in viscosity is 20 Pa or less.
Inventors:
CHA HANEUL (JP)
FUKUDA SHINICHIRO (JP)
NAKAI KOSHIN (JP)
SHIINA TOUKO (JP)
FUKUDA SHINICHIRO (JP)
NAKAI KOSHIN (JP)
SHIINA TOUKO (JP)
Application Number:
PCT/JP2019/040684
Publication Date:
June 25, 2020
Filing Date:
October 16, 2019
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
C08F2/44; G03F7/027; C08F2/50; G03F7/004; H05K3/28
Foreign References:
| JP2011048313A | 2011-03-10 | |||
| JP2011185962A | 2011-09-22 | |||
| JP2011215392A | 2011-10-27 | |||
| JP2018077490A | 2018-05-17 | |||
| JP2005331966A | 2005-12-02 | |||
| KR20090072177A | 2009-07-02 | |||
| JP2014156583A | 2014-08-28 |
Other References:
See also references of EP 3901699A4
Attorney, Agent or Firm:
ETOH Toshiaki (JP)
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