Title:
CURABLE RESIN COMPOSITION, DRY FILM AND CURED PRODUCT OF SAME, AND ELECTRONIC COMPONENT CONTAINING SAID CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2021/045085
Kind Code:
A1
Abstract:
[Problem] To provide: a curable resin composition which has excellent heat resistance and low warping properties, while enabling the achievement of a cured product having improved light transmittance; a dry film and a cured product of the curable resin composition; and an electronic component which contains the cured product. [Solution] A curable resin composition which is characterized by containing (A) an amide imide resin, (B) a thermosetting resin, (C) a thermal curing accelerator and (D) inorganic particles, and which is also characterized in that the amide imide resin (A) is a reaction product of a tricarboxylic acid anhydride having an aliphatic structure and an isocyanurate-type polyisocyanate that is synthesized from an isocyanate having an aliphatic structure, while having a number average molecular weight of from 500 to 1,000; a dry film and a cured product of the curable resin composition; and an electronic component which contains the cured product. [Selected drawing] None
Inventors:
SHIBASAKI YOKO (JP)
FUNAKOSHI CHIHIRO (JP)
FUNAKOSHI CHIHIRO (JP)
Application Number:
PCT/JP2020/033228
Publication Date:
March 11, 2021
Filing Date:
September 02, 2020
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
C08G59/20; C08G18/34; C08G18/79; C08K3/00; C08L79/04; C08L101/00; H05K1/03; H05K3/28
Domestic Patent References:
| WO2017221922A1 | 2017-12-28 | |||
| WO2015008744A1 | 2015-01-22 |
Foreign References:
| JP2018189851A | 2018-11-29 | |||
| JP2015155500A | 2015-08-27 |
Attorney, Agent or Firm:
ETOH Toshiaki (JP)
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