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Title:
CURABLE RESIN COMPOSITION AND ELECTRICAL COMPONENT USING THIS
Document Type and Number:
WIPO Patent Application WO/2019/107201
Kind Code:
A1
Abstract:
This curable resin composition contains (meth)acrylic polyols, polycarbonate polyols, and polyisocyanate. The (meth)acrylic polyols are configured from a polymer which has a hydroxyl value of 5 to 150 mgKOH/g, a glass transition temperature of -70°C to -40°C, and a number average molecular weight of 500 to 20,000, and which is liquid at 25°C. The electrical component (1) comprises a sealing material (2) formed from a cured product of the curable resin composition.

Inventors:
OKUHIRA HIROYUKI (JP)
TAKAKURA AKIRA (JP)
Application Number:
PCT/JP2018/042663
Publication Date:
June 06, 2019
Filing Date:
November 19, 2018
Export Citation:
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Assignee:
DENSO CORP (JP)
International Classes:
C08G18/40; C08G18/10; C08G18/65; C08G18/72; C08G18/78; C08G18/79; C09J133/14; C09J169/00; C09J175/04; C09J175/06; C09K3/10
Foreign References:
JP2011105819A2011-06-02
JP2012212805A2012-11-01
JP2006182904A2006-07-13
JP2017066214A2017-04-06
US20140255560A12014-09-11
Attorney, Agent or Firm:
AICHI, TAKAHASHI, IWAKURA & ASSOCIATES (JP)
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