Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/171004
Kind Code:
A1
Abstract:
A curable resin composition which comprises one or more epoxy resins and one or more hardeners, wherein the epoxy resins comprise an epoxy resin including an aromatic ring having no electron-donating group bonded thereto and having an epoxidized group bonded thereto and the hardeners comprise a hardener including an aromatic ring having an electron-donating group bonded thereto and having a hydroxyl group bonded thereto.

More Like This:
WO/2014/157446CURABLE EPOXY COMPOSITION, FILM, MULTILAYER FILM, PREPREG, LAMINATE, CURED PRODUCT, AND COMPOSITE BODY
JPS6424713EXTERIOR RIM MATERIAL AND ITS MOLDING PROCESS
JPH08188639PERFLUOROALKYLATED RESIN AND ITS USE
Inventors:
YAMAMOTO TAKASHI (JP)
ARATA MICHITOSHI (JP)
TAKEUCHI YUMA (JP)
NAKAMURA KASUMI (JP)
Application Number:
PCT/JP2020/005993
Publication Date:
August 27, 2020
Filing Date:
February 17, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08G59/46
Domestic Patent References:
WO2011052157A12011-05-05
WO2012165439A12012-12-06
Foreign References:
JP2009179764A2009-08-13
JP2008231239A2008-10-02
JP2006002139A2006-01-05
JP2008063555A2008-03-21
JP2009231605A2009-10-08
JP2011068713A2011-04-07
JP2012088459A2012-05-10
JPS61268721A1986-11-28
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: CLEANING LIQUID FOR REMOVING CERIUM COMPOUNDS, CLEANING METHOD, AND METHOD FOR PRODUCING SEMICONDUCT...

Next Patent: MEASURING INSTRUMENT