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Title:
CURABLE RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/032860
Kind Code:
A1
Abstract:
In a chart regarding this curable resin composition which is obtained by performing dynamic viscoelasticity measurement of a cured resin product of the curable resin composition and in which tan δ is the vertical axis and the horizontal axis is set to include temperatures of 30°C-260°C, (1) the temperature at which tan δ is greatest is less than 120°C, (2) the maximum value of tan δ exceeds 0.400, and (3) the total of the values of tan δ at each of the temperatures 220°C, 230°C, 240°C, and 250°C exceeds 0.400, or the total of the values of tan δ at each of the temperatures 70°C, 80°C, and 90°C exceeds 0.600.

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Inventors:
KANG DONGCHUL (JP)
HATAKEYAMA KEIICHI (JP)
NISHIYAMA TOMOO (JP)
YAMAMOTO TAKAYA (JP)
KIM KIFA (JP)
YOKOKURA AI (JP)
Application Number:
PCT/JP2022/032271
Publication Date:
March 09, 2023
Filing Date:
August 26, 2022
Export Citation:
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Assignee:
RESONAC CORP (JP)
International Classes:
C08L101/00; C08G59/62; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
WO2020080370A12020-04-23
WO2021075207A12021-04-22
WO2019240079A12019-12-19
Foreign References:
JP2020063404A2020-04-23
JP2020063388A2020-04-23
JP2020045380A2020-03-26
JPH06200121A1994-07-19
US20140179834A12014-06-26
US20140179833A12014-06-26
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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