Title:
CURABLE RESIN COMPOSITION, AND FILM, MOLDED ARTICLE, PREPREG, AND FIBER-REINFORCED PLASTIC USING SAID CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/117214
Kind Code:
A1
Abstract:
Provided is a curable resin composition comprising components (A), (B), (C), and (D). Component (A) is a bisphenol-type epoxy resin having a softening point of 80°C or higher; component (B) is a bisphenol-type epoxy resin in liquid form at 25°C; component (C) is a (meth)acrylate compound that is difunctional or higher; and component (D) is a curing agent.
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Inventors:
USHIYAMA HISAYA (JP)
DEGUCHI NAO (JP)
WATANABE KENICHI (JP)
FUJIMOTO JUICHI (JP)
DEGUCHI NAO (JP)
WATANABE KENICHI (JP)
FUJIMOTO JUICHI (JP)
Application Number:
PCT/JP2017/045922
Publication Date:
June 28, 2018
Filing Date:
December 21, 2017
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08G59/20; C08F2/44; C08G59/50; C08J5/24; C08L63/02; C08L101/00
Domestic Patent References:
| WO2016121395A1 | 2016-08-04 | |||
| WO2007032326A1 | 2007-03-22 | |||
| WO1998044017A1 | 1998-10-08 | |||
| WO2016104314A1 | 2016-06-30 | |||
| WO2016035459A1 | 2016-03-10 | |||
| WO2016060166A1 | 2016-04-21 | |||
| WO2014007288A1 | 2014-01-09 |
Foreign References:
| JPS62187722A | 1987-08-17 | |||
| JP2000509743A | 2000-08-02 | |||
| JP2002194057A | 2002-07-10 | |||
| JP2016069563A | 2016-05-09 | |||
| JP2011202043A | 2011-10-13 | |||
| JPH10290851A | 1998-11-04 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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