CURABLE RESIN COMPOSITION FOR FORMING ADHESIVE LAYER, AND METHOD FOR INTEGRATING BASE AND BASE TO BE BONDED

WIPO Patent Application WO/2013/146801

A1

To provide a curable resin composition for forming an adhesive layer, which is capable of reliably bonding a base that is called a slightly adhesive base. A curable resin composition for forming an adhesive layer, which contains a combination of a resin having at least one kind of thermosetting functional group and a curing agent having a thermosetting functional group that is thermosettingly reactive with the thermosetting functional group of the resin. This curable resin composition for forming an adhesive layer is characterized in that: (i) a desorbed material is not generated by the thermosetting reaction; (ii) nitrogen element is contained as an element that constitutes the thermosetting functional group of the resin and/or the thermosetting functional group of the curing agent; and (iii) the concentration of the thermosetting functional group that contains nitrogen element as a constituent element in the resin solids of the curable resin composition for forming an adhesive layer is 0.03-2.4 mmol/g.

OJIMA TAKEHIRO (JP)
MASUDA KAZUAKI (JP)
SATOH HIDEYUKI (JP)

PCT/JP2013/058830

October 03, 2013

March 26, 2013

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NIPPON PAINT CO LTD (JP)

C09D201/00; B05D7/24; B32B7/10; B32B37/10; C09J5/06; C09J7/00; C09J201/00

WO2011132551A1	2011-10-27
WO2007088721A1	2007-08-09
WO2011129413A1	2011-10-20
WO2010038643A1	2010-04-08

JP2007125539A	2007-05-24
JP2009234009A	2009-10-15
JP2007224093A	2007-09-06
JP2001079994A	2001-03-27
JP2008239911A	2008-10-09

SAMEJIMA, Mutsumi et al. (JP)
Mutsumi Sameshima (JP)

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