Title:
CURABLE RESIN COMPOSITION, HARD COAT FILM AND METHOD FOR PRODUCING SAME, AND DISPLAY
Document Type and Number:
WIPO Patent Application WO/2024/029496
Kind Code:
A1
Abstract:
This curable resin composition contains a polyorganosiloxane compound that has an alicyclic epoxy group and an epoxy compound that has a plurality of glycidyl epoxy groups. The polyorganosiloxane compound is a condensate of a silane compound containing a silane compound represented by general formula (1). The epoxy compound is trimethylolpropane triglycidyl ether or a compound represented by general formula (4). The content of the epoxy compound in the curable composition is 1-190 weight parts per 100 weight parts of the polyorganosiloxane compound. [Y-Si(OR1)xR2
3-x] (1)
Inventors:
TAGUCHI YUSUKE (JP)
Application Number:
PCT/JP2023/027976
Publication Date:
February 08, 2024
Filing Date:
July 31, 2023
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08L63/00; B05D5/00; B05D7/24; B32B27/34; B32B27/38; C08G59/32; C08G77/14; C08L83/06; C09D5/00; C09D163/00; C09D183/04
Domestic Patent References:
WO2022102736A1 | 2022-05-19 | |||
WO2020040209A1 | 2020-02-27 | |||
WO2020209194A1 | 2020-10-15 |
Foreign References:
CN103360651A | 2013-10-23 | |||
CN113845842A | 2021-12-28 | |||
JP2021075656A | 2021-05-20 |
Attorney, Agent or Firm:
HARUKA PATENT & TRADEMARK ATTORNEYS (JP)
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