Title:
CURABLE RESIN COMPOSITION AND HOT MELT ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2023/054336
Kind Code:
A1
Abstract:
The present invention provides a curable resin composition that is superior in terms of the storage stability, the pot life properties, the curability, and the adhesion strengths at room temperature and high temperatures and that has sufficient heat-resistant creep properties. Specifically, the present invention provides a curable resin composition that contains a silane-modified organic polymer, a curing catalyst, and an alcohol and in which the relative energy difference (RED), expressed by the following formula, between the silane-modified organic polymer and the alcohol is 1.0-3.0. (In the formula, R0 is the interaction radius of the silane-modified organic polymer, and Ra-b is the distance between the Hansen solubility parameter (HSP) value of the silane-modified organic polymer and the Hansen solubility parameter (HSP) value of the alcohol.)
Inventors:
YOSHINO KENTO (JP)
SASAI TAMAYO (JP)
SASAI TAMAYO (JP)
Application Number:
PCT/JP2022/035885
Publication Date:
April 06, 2023
Filing Date:
September 27, 2022
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C08L101/10; C08F8/42; C08G65/336; C09J11/06; C09J123/26
Domestic Patent References:
| WO2017047805A1 | 2017-03-23 |
Foreign References:
| JP2019006971A | 2019-01-17 | |||
| JP2020158626A | 2020-10-01 | |||
| JP2001107018A | 2001-04-17 | |||
| JPH08225738A | 1996-09-03 | |||
| JPS59170168A | 1984-09-26 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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