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Title:
CURABLE RESIN COMPOSITION, AND IMAGE-SENSOR-CHIP PRODUCTION METHOD AND IMAGE SENSOR CHIP USING SAME
Document Type and Number:
WIPO Patent Application WO/2014/084288
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a curable resin composition with which an image sensor chip in which colour shading is inhibited can be produced; and an image-sensor-chip production method and an image sensor chip in which said curable resin composition is used. Provided is a curable resin composition which can be applied upon a solid-state-imaging-element substrate, and which includes a pigment having a maximum absorption wavelength in the wavelength range 600-850 nm. Also provided are an image-sensor-chip production method and an image sensor chip in which said curable resin composition is used.

Inventors:
EZOE TOSHIHIDE (JP)
SHIMADA KAZUTO (JP)
Application Number:
PCT/JP2013/081979
Publication Date:
June 05, 2014
Filing Date:
November 27, 2013
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G02B5/22; C08L101/00; C09D7/12; C09D201/00; H01L27/14; H04N5/225; H04N5/335
Domestic Patent References:
WO2005030898A12005-04-07
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JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY, 1995, pages 202 - 232
See also references of EP 2927716A4
Attorney, Agent or Firm:
TAKAMATSU Takeshi et al. (JP)
Takamatsu 猛 (JP)
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