Title:
CURABLE RESIN COMPOSITION, INSULATING CURED FILM AND INSULATING CURED FILM FOR TOUCH PANEL THAT RESULT FROM CURING SAID COMPOSITION, AND TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2024/005195
Kind Code:
A1
Abstract:
A curable resin composition including: a heat-curable alkali-soluble resin (A1) that has an acid value of 55-100 mgKOH/g; a photocurable alkali-soluble resin (A2); a (meth)acrylic monomer (B) that has two polymerizable functional groups and a ring structure included between the two polymerizable functional groups; and a photopolymerization initiator (C), wherein the mass ratio [A:B] of the total quantity [A] of the heat-curable alkali-soluble resin (A1) and the photocurable alkali-soluble resin (A2) and the total quantity [B] of the (meth)acrylic monomer (B) is 100:35-80.
Inventors:
OOURA YUUKI (JP)
ITO AKARI (JP)
ITO AKARI (JP)
Application Number:
PCT/JP2023/024423
Publication Date:
January 04, 2024
Filing Date:
June 30, 2023
Export Citation:
Assignee:
OSAKA ORGANIC CHEMICAL IND LTD (JP)
International Classes:
C08F290/12; G06F3/044
Domestic Patent References:
WO2019117018A1 | 2019-06-20 |
Foreign References:
JP2019101322A | 2019-06-24 | |||
JP2016181083A | 2016-10-13 | |||
JP2018109733A | 2018-07-12 | |||
JP2021521310A | 2021-08-26 | |||
JP2015127730A | 2015-07-09 | |||
JP2015087541A | 2015-05-07 | |||
CN113485071A | 2021-10-08 | |||
KR20210106351A | 2021-08-30 | |||
KR20210131560A | 2021-11-03 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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