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Title:
CURABLE RESIN COMPOSITION AND METHOD FOR FORMING CURED COATING FILM
Document Type and Number:
WIPO Patent Application WO/2008/013207
Kind Code:
A1
Abstract:
Disclosed is a curable resin composition containing a copolymer having a monomer unit (A) containing an alkali-soluble group and a monomer unit (B) corresponding to a curable group-containing polymerizable unsaturated compound, and an organic solvent having a boiling point at atmospheric pressure of not less than 180˚C. The ratio of the monomer unit (B) relative to the total monomer units constituting the copolymer is 5-95% by weight, and not less than 30% by weight of the monomer unit (B) is composed of a monomer unit corresponding to at least one compound selected from 3,4-epoxytricyclo[5.2.1.02.6]decane ring-containing compounds. This curable resin composition enables to form a coating film excellent in transparency, heat resistance and the like. In particular, no partial variations in coating thickness or coating defects occur when a coating film is formed by a slit coating method or inkjet method by using this curable resin composition.

Inventors:
MORI, Misao (JR Shinagawa East Bldg. 2-18-1, Konan, Minato-k, Tokyo 30, 1088230, JP)
森 三佐雄 (〒30 東京都港区港南2-18-1 JR品川イーストビル ダイセル化学工業株式会社内 Tokyo, 1088230, JP)
TAKAWAKI, Koichi (111-1 Nishioka, Uozumi-cho Akashi-sh, Hyogo 84, 6740084, JP)
Application Number:
JP2007/064603
Publication Date:
January 31, 2008
Filing Date:
July 25, 2007
Export Citation:
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Assignee:
DAICEL CHEMICAL INDUSTRIES, LTD. (MAINICHI INTECIO, 3-4-5 Umeda, Kita-ku, Osaka-sh, Osaka 01, 5300001, JP)
ダイセル化学工業株式会社 (〒01 大阪府大阪市北区梅田三丁目4番5号 毎日インテシオ Osaka, 5300001, JP)
MORI, Misao (JR Shinagawa East Bldg. 2-18-1, Konan, Minato-k, Tokyo 30, 1088230, JP)
森 三佐雄 (〒30 東京都港区港南2-18-1 JR品川イーストビル ダイセル化学工業株式会社内 Tokyo, 1088230, JP)
International Classes:
C08L33/14; C08F220/32; C09D133/14; G03F7/033; G03F7/038; G03F7/16
Attorney, Agent or Firm:
GOTO, Yukihisa (Minamimorimachi Kyodo Bldg, 2nd Floor 2-18, Kobai-cho,Kita-ku, Osaka-sh, Osaka 38, 5900038, JP)
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