Title:
CURABLE RESIN COMPOSITION, RESIN MOLD FOR IMPRINTING, LIGHT IMPRINTING METHOD, PRODUCTION METHOD FOR SEMICONDUCTOR INTEGRATED CIRCUIT, AND PRODUCTION METHOD FOR MICRO-OPTICAL ELEMENT
Document Type and Number:
WIPO Patent Application WO/2014/104074
Kind Code:
A1
Abstract:
A curable resin composition characterized by containing a fluorinated urethane (meth) acrylate indicated by formula (1). (1) (In the formula: R1, R2, R3, and R4 each independently indicate a hydrogen atom or a methyl group; x and y each independently indicate 1 or 2; and n indicates an integer between 1 and 10. However, when x and y are both 1, R3 and R4 each indicate a hydrogen atom; when x is 1 and y is 2, R3 indicates a hydrogen atom and R4 indicates a methyl group; when x is 2 and y is 1, R3 indicates a methyl group and R4 indicates a hydrogen atom; and when x and y are both 2, R3 and R4 each indicate a methyl group.)
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Inventors:
WADA RISA (JP)
OHSAKI TAKESHI (JP)
OHSAKI TAKESHI (JP)
Application Number:
PCT/JP2013/084614
Publication Date:
July 03, 2014
Filing Date:
December 25, 2013
Export Citation:
Assignee:
TOYO GOSEI CO LTD (JP)
International Classes:
C08F299/06; B29C59/02; H01L21/027; B29K33/04
Domestic Patent References:
| WO2010147142A1 | 2010-12-23 |
Foreign References:
| JP2012518067A | 2012-08-09 | |||
| JP2012528217A | 2012-11-12 | |||
| JP2007527784A | 2007-10-04 |
Attorney, Agent or Firm:
KURIHARA, Hiroyuki et al. (JP)
Hiroyuki Kurihara (JP)
Hiroyuki Kurihara (JP)
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