Title:
CURABLE RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2012/014641
Kind Code:
A1
Abstract:
A curable resin composition comprising: a polymer (A) which has a main chain comprising carbon atoms and a side chain having a polymerizable unsaturated linking group, and also has a cyclic structure in the main chain and/or the side chain; and a compound having a polymerizable unsaturated group has optical properties, heat resistance, and high moldability.
Inventors:
MOCHIZUKI HIROAKI (JP)
MOROOKA NAOYUKI (JP)
OKUTSU RIE (JP)
OBAYASHI TATSUHIKO (JP)
MOROOKA NAOYUKI (JP)
OKUTSU RIE (JP)
OBAYASHI TATSUHIKO (JP)
Application Number:
PCT/JP2011/065427
Publication Date:
February 02, 2012
Filing Date:
July 06, 2011
Export Citation:
Assignee:
FUJIFILM CORP (JP)
MOCHIZUKI HIROAKI (JP)
MOROOKA NAOYUKI (JP)
OKUTSU RIE (JP)
OBAYASHI TATSUHIKO (JP)
MOCHIZUKI HIROAKI (JP)
MOROOKA NAOYUKI (JP)
OKUTSU RIE (JP)
OBAYASHI TATSUHIKO (JP)
International Classes:
C08F265/06; C08F220/18; C08F220/40; C08F222/40; C08F232/00
Domestic Patent References:
| WO2009110453A1 | 2009-09-11 |
Foreign References:
| JP2009102500A | 2009-05-14 | |||
| JP2003012738A | 2003-01-15 | |||
| JP2004263135A | 2004-09-24 | |||
| JP2010138370A | 2010-06-24 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
Patent business corporation patent firm Sykes (JP)
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Claims: