CURABLE RESIN COMPOSITION, CURABLE RESIN MOLDED BODY, CURED RESIN MOLDED BODY, METHOD FOR PRODUCING EACH OF SAME, AND LAMINATE BODY

WIPO Patent Application WO/2013/089091

A1

The present invention is: a curable resin composition, which contains a thermoplastic resin (A), a curable monomer (B), and a photoinitiator (C), and is characterized by the thermoplastic resin (A) having an aromatic ring and having a glass transition temperature (Tg) of at least 140°C, and the photoinitiator (C) having a light absorbance at 380 nm when measured in a 0.1 mass% acetonitrile solution of at least 0.4; a curable resin molded body obtained by molding the composition; a cured resin molded body obtained by curing the curable resin molded body; and a laminate body having a layer comprising the cured resin. The present invention provides: a cured resin molded body having superior heat resistance, a low residual quantity of low-boiling point substances such as a solvent or curable monomer, and has low birefringence; a method for producing the cured resin molded body; a curable resin composition and curable resin molded body useful as the starting material of the cured resin molded body; and a laminate body having a layer comprising the cured resin.

ITO MASAHARU (JP)
IWAYA WATARU (JP)
FUJIMOTO HIRONOBU (JP)
TAYA NAOKI (JP)

PCT/JP2012/082051

June 20, 2013

December 11, 2012

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LINTEC CORP (JP)

C08F2/50

JPH0616720A	1994-01-25
JP2012008547A	2012-01-12
JP2010020077A	2010-01-28
JP2009192632A	2009-08-27
JP2007254620A	2007-10-04
JP2003026715A	2003-01-29
JP2002328471A	2002-11-15
JP2002296773A	2002-10-09
JP2002256039A	2002-09-11

OHISHI HARUHITO (JP)
Haruhito Oishi (JP)

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