Title:
CURABLE RESIN COMPOSITION, CURABLE RESIN MOLDED BODY, CURED RESIN MOLDED BODY, METHOD FOR PRODUCING EACH OF SAME, AND LAMINATE BODY
Document Type and Number:
WIPO Patent Application WO/2013/089092
Kind Code:
A1
Abstract:
Provided is a curable resin composition containing: a thermoplastic resin (A) having a ring structure in the main chain and a glass transition temperature (Tg) of at least 140°C; and a monofunctional curable monomer (B). The present invention provides: a cured resin molded body having heat resistance, a low phase difference in the thickness direction, and superior low birefringence; a method for producing the cured resin molded body; a curable resin composition and curable resin molded body useful as the starting material for the cured resin molded body; and a laminate body having a layer comprising the cured resin.
Inventors:
ITO MASAHARU (JP)
IWAYA WATARU (JP)
FUJIMOTO HIRONOBU (JP)
TAYA NAOKI (JP)
IWAYA WATARU (JP)
FUJIMOTO HIRONOBU (JP)
TAYA NAOKI (JP)
Application Number:
PCT/JP2012/082052
Publication Date:
June 20, 2013
Filing Date:
December 11, 2012
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C08F2/44; C08J7/043; C08J7/046
Foreign References:
| JP2012008547A | 2012-01-12 | |||
| JP2007254620A | 2007-10-04 | |||
| JP2000319483A | 2000-11-21 | |||
| JPH0616720A | 1994-01-25 | |||
| JPS5377246A | 1978-07-08 | |||
| JP2004238532A | 2004-08-26 | |||
| JP2001056631A | 2001-02-27 |
Attorney, Agent or Firm:
OHISHI HARUHITO (JP)
Haruhito Oishi (JP)
Haruhito Oishi (JP)
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Claims: