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Title:
CURABLE RESIN COMPOSITION, COMPOSITION FOR MOLDING, RESIN MOLDED ARTICLE, AND METHOD FOR PRODUCING RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2017/030098
Kind Code:
A1
Abstract:
Disclosed is a curable resin composition containing a radical-polymerizable monomer that contains a monofunctional radical polymerizable monomer, a linear or branched polymer that contains a polyoxyalkylene chain, and a radical polymerization initiator.

Inventors:
SHIRASAKA TOSHIAKI (JP)
YOKOYAMA KOSUKE (JP)
TAKEUCHI KAZUMASA (JP)
OCHIAI BUNGO (JP)
CHIBA KAZUKI (JP)
KIRYU TOMONARI (JP)
Application Number:
PCT/JP2016/073791
Publication Date:
February 23, 2017
Filing Date:
August 12, 2016
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08F2/44; C08J5/00
Foreign References:
JP2012041491A2012-03-01
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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