Title:
CURABLE RESIN COMPOSITION, COMPOSITION FOR MOLDING, RESIN MOLDED ARTICLE, AND METHOD FOR PRODUCING RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2017/030098
Kind Code:
A1
Abstract:
Disclosed is a curable resin composition containing a radical-polymerizable monomer that contains a monofunctional radical polymerizable monomer, a linear or branched polymer that contains a polyoxyalkylene chain, and a radical polymerization initiator.
Inventors:
SHIRASAKA TOSHIAKI (JP)
YOKOYAMA KOSUKE (JP)
TAKEUCHI KAZUMASA (JP)
OCHIAI BUNGO (JP)
CHIBA KAZUKI (JP)
KIRYU TOMONARI (JP)
YOKOYAMA KOSUKE (JP)
TAKEUCHI KAZUMASA (JP)
OCHIAI BUNGO (JP)
CHIBA KAZUKI (JP)
KIRYU TOMONARI (JP)
Application Number:
PCT/JP2016/073791
Publication Date:
February 23, 2017
Filing Date:
August 12, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08F2/44; C08J5/00
Foreign References:
JP2012041491A | 2012-03-01 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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