Title:
CURABLE RESIN COMPOSITION AND PROCESS FOR PRODUCTION THEREOF
Document Type and Number:
WIPO Patent Application WO/2004/076555
Kind Code:
A1
Abstract:
The invention provides a curable resin composition which is excellent in weather resistance, transparency and handleability and exhibits a low modulus and excellent elongation characteristics; a process for producing the same; and a resin composition to be used in the process. That is, a process for the production of a curable resin composition comprising an oxyalkylene polymer (A) having a reactive silicon group and a polymer (B) which has a reactive silicon group and whose molecular chain is substantially composed of alkyl (meth)acrylate units wherein each alkyl group has 1 to 24 carbon atoms, which process comprises producing the polymer (B) by polymerization in a polymeric organic plasticizer (C) and mixing the reaction mixture obtained by the polymerization with the oxyalkylene polymer (A).
Inventors:
KASAI MITSUHIRO (JP)
TAMAI HITOSHI (JP)
KOMITSU SHINTARO (JP)
TAMAI HITOSHI (JP)
KOMITSU SHINTARO (JP)
Application Number:
PCT/JP2004/002045
Publication Date:
September 10, 2004
Filing Date:
February 20, 2004
Export Citation:
Assignee:
KANEKA CORP (JP)
KASAI MITSUHIRO (JP)
TAMAI HITOSHI (JP)
KOMITSU SHINTARO (JP)
KASAI MITSUHIRO (JP)
TAMAI HITOSHI (JP)
KOMITSU SHINTARO (JP)
International Classes:
C08G65/336; C08L43/04; C08L71/02; C09D143/04; C08L33/06; (IPC1-7): C08L33/06; C08L71/02
Foreign References:
| JP2002294022A | 2002-10-09 | |||
| JP2002069288A | 2002-03-08 | |||
| JPH07233316A | 1995-09-05 |
Attorney, Agent or Firm:
KANEKA CORPORATION (Kita-ku Osaka-shi Osaka, 88, JP)
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