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Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, CURED PRODUCT OF SAME, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/138268
Kind Code:
A1
Abstract:
Provided is a curable resin composition for semiconductor encapsulation, which is capable of forming a cured product that is not susceptible to the occurrence of warp. A curable resin composition for semiconductor encapsulation, which is characterized by containing an inorganic filler (A) and a curable resin film (B) that is formed so as to cover the surface of the inorganic filler (A). It is preferable that the content of the inorganic filler (A) is 75-99% by weight relative to the total weight of the resin composition for semiconductor encapsulation. It is also preferable that the curable resin film (B) contains an epoxy compound (a) and a curing agent (b) or a curing catalyst (d).

Inventors:
SATO ATSUSHI (JP)
Application Number:
PCT/JP2016/088480
Publication Date:
August 17, 2017
Filing Date:
December 22, 2016
Export Citation:
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Assignee:
DAICEL CORP (JP)
International Classes:
C08L63/00; C08K9/04; H01L23/29; H01L23/31
Domestic Patent References:
WO2012017571A12012-02-09
WO2015030089A12015-03-05
Foreign References:
JP2006022316A2006-01-26
JP2012241180A2012-12-10
Attorney, Agent or Firm:
GOTO & CO. (JP)
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