Title:
CURABLE RESIN COMPOSITION, RESIN SHEET AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2024/070793
Kind Code:
A1
Abstract:
The present invention provides a curable resin composition which exhibits good curability, while having high heat resistance and low water absorption characteristics. This curable resin composition contains (A) a maleimide compound and (B) a compound which has, as a partial structure, a functional group that has a Q value within a specific range and an e value within a specific range, the Q value being the index of the stability of radicals and the e value being the index of the polarity of radicals.
Inventors:
TOHJIMA TAKAYUKI (JP)
NAKANISHI MASATAKA (JP)
HASHIMOTO MASANORI (JP)
NAKANISHI MASATAKA (JP)
HASHIMOTO MASANORI (JP)
Application Number:
PCT/JP2023/033835
Publication Date:
April 04, 2024
Filing Date:
September 19, 2023
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08F222/40
Attorney, Agent or Firm:
MIKAMI Yoko (JP)
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