CURABLE RESIN COMPOSITION, COMPOSITION FOR SOLDER RESIST FORMATION, DRY FILM AND PRINTED WIRING BOARD, AND LAMINATED STRUCTURE, AND METHOD FOR PRODUCING SAME

WIPO Patent Application WO/2014/050977

A1

The invention provides a curable resin composition that makes it possible to obtain a cured product having excellent insulation reliability while maintaining adhesiveness, a composition for solder resist formation, a dry film and printed wiring board, and a laminated structure having a resin insulating layer having excellent insulation reliability while maintaining adhesiveness, and methods for producing a dry film used to produce this laminated structure and a laminated structure using this dry film. The curable resin composition contains (A) an imidazole-isocyanate adduct, (B) a carboxyl group-containing resin, and (C) a thermocurable resin; and the laminated structure has a substrate and a plurality of resin insulating layers formed on the substrate, the resin insulating layer in contact with the substrate among the plurality of resin insulating layers being a layer formed from the curable resin composition.

OKAMOTO DAICHI (JP)
MINEGISHI SHOJI (JP)

PCT/JP2013/076085

April 03, 2014

September 26, 2013

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TAIYO INK MFG CO LTD (JP)

C08L101/08; C07D233/61; C08K3/28; C08K5/3445; C08L63/00; H05K3/28

WO2011122028A1

2011-10-06

JP2001324805A	2001-11-22
JP2001305726A	2001-11-02
JP2001209175A	2001-08-03
JP2012017444A	2012-01-26
JP2009185181A	2009-08-20
JP2007197530A	2007-08-09
JP2000290260A	2000-10-17
JP2010261032A	2010-11-18

ETOH TOSHIAKI (JP)
Toshiaki Eto (JP)

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