Title:
CURABLE RESIN COMPOSITION AND STRUCTURAL MATERIAL BONDING ADHESIVE AGENT USING SAID COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/020875
Kind Code:
A1
Abstract:
[Problem] To provide a curable resin composition that is suitable as a structural material bonding adhesive agent having a satisfactory adhesiveness particularly to aluminium. [Solution] A curable resin composition containing: (A1) a phosphoric acid-modified epoxy resin (excluding a urethane-modified epoxy resin and a urethane-modified chelated epoxy resin) obtained by reacting phosphoric acids (a1) with an epoxy compound (a2); (A2) an epoxy resin (excluding the (A1) component); (B) a block urethane; and (C) a latent curing agent, wherein the phosphorus content in the total mass of the (A1) component and the (A2) component is 0.01-2.0 mass%.
Inventors:
IDE MITSUNORI (JP)
OTA KEISUKE (JP)
NAGAMATSU TAMOTSU (JP)
OTA KEISUKE (JP)
NAGAMATSU TAMOTSU (JP)
Application Number:
PCT/JP2017/021755
Publication Date:
February 01, 2018
Filing Date:
June 13, 2017
Export Citation:
Assignee:
ADEKA CORP (JP)
International Classes:
C08G59/20; C08G18/58; C08G18/80; C08G59/14; C09J11/06; C09J163/00; C09J163/02; C09J175/04
Foreign References:
| JP2007083525A | 2007-04-05 | |||
| JP2007185915A | 2007-07-26 | |||
| JP2006077115A | 2006-03-23 | |||
| JP2004269679A | 2004-09-30 | |||
| JPH0741750A | 1995-02-10 | |||
| JPH06145629A | 1994-05-27 | |||
| JP2008239890A | 2008-10-09 | |||
| JP2012082347A | 2012-04-26 |
Other References:
See also references of EP 3492508A4
Attorney, Agent or Firm:
IZAWA Makoto (JP)
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