CURABLE RESIN COMPOSITION, SUBSTANCE RESULTING FROM CURING SAME, PHENOL RESIN, EPOXY RESIN, AND SEMICONDUCTOR SEALING MATERIAL

WIPO Patent Application WO/2012/043563

A1

In order to combine a high degree of resistance to moisture and solder with a high degree of flame retardancy, with no halogens used so as to be environmentally friendly, a phenol resin having the following structural units is used as a hardener for an epoxy resin: an aromatic hydrocarbon group (ph1) containing a naphthylmethyloxy group or an anthranylmethyloxy group; an aromatic hydrocarbon group (ph2) containing a phenolic hydroxyl group; and a divalent aralkyl group (X) represented by general formula (1) (in which Ar represents a phenylene group or a biphenylene group and each R independently represents a hydrogen atom or a methyl group). Said phenol resin has a structure wherein a plurality of aromatic hydrocarbon groups selected from among aromatic hydrocarbon groups (ph1) containing a naphthylmethyloxy group or an anthranylmethyloxy group and aromatic hydrocarbon groups (ph2) containing a phenolic hydroxyl group are coupled via the aforementioned divalent aralkyl group (X).

OGURA ICHIROU (JP)
TAKAHASHI YOSHIYUKI (JP)
NAGAE NORIO (JP)
HIROTA YOUSUKE (JP)

PCT/JP2011/072081

April 05, 2012

September 27, 2011

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DAINIPPON INK & CHEMICALS (JP)
OGURA ICHIROU (JP)
TAKAHASHI YOSHIYUKI (JP)
NAGAE NORIO (JP)
HIROTA YOUSUKE (JP)

C08G59/62; C08G8/04; C08G59/20; C08G61/02; C08L63/00

WO2008041749A1

2008-04-10

JP2006097004A	2006-04-13
JP2006307162A	2006-11-09
JP2007023213A	2007-02-01
JP2006117761A	2006-05-11
JP2009286944A	2009-12-10
JP2009286949A	2009-12-10

KONO MICHIHIRO (JP)
Michihiro Kono (JP)

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