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Title:
CURABLE RESIN COMPOSITION, VARNISH, PREPREG, CURED PRODUCT, LAMINATE AND COPPER-CLAD LAMINATE
Document Type and Number:
WIPO Patent Application WO/2019/078300
Kind Code:
A1
Abstract:
Provided is a curable resin composition that exhibits excellent solubility in solvents and enables the achievement of a cured product which has excellent heat resistance, thermal decomposition characteristics, dielectric characteristics, water absorption characteristics and chemical resistance, and which is suitable for a fiber-reinforced composite material that is used in printed wiring boards for electronic devices or in the field of aerospace. A curable resin composition which contains (A) a maleimide resin and (B) a benzoxazine resin that is represented by formula (1). (In formula (1), n represents the average of the numbers of repetitions, which is a real number of 1-10; each of R1-R8 independently represents a hydrogen atom, a halogen atom, an alkyl group having 1-8 carbon atoms or an aryl group; in cases where there are a plurality of each of the R3-R7 moieties, the R3-R7 moieties may be the same as or different from each other, respectively; each of R9 and R10 independently represents a hydrogen atom, an alkyl group having 1-8 carbon atoms, an aryl group, an allyl group or an alkoxy group; in cases where there are a plurality of each of the R9 and R10 moieties, the R9 and R10 moieties may be the same as or different from each other, respectively; and the dotted lines indicate that a benzene ring may be formed.)

Inventors:
MATSUURA Kazuki (3-31-12 Shimo, Kita-k, Tokyo 88, 〒1158588, JP)
NAKANISHI Masataka (3-31-12 Shimo, Kita-k, Tokyo 88, 〒1158588, JP)
KUBOKI Kenichi (3-31-12 Shimo, Kita-k, Tokyo 88, 〒1158588, JP)
Application Number:
JP2018/038852
Publication Date:
April 25, 2019
Filing Date:
October 18, 2018
Export Citation:
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Assignee:
NIPPON KAYAKU KABUSHIKI KAISHA (1-1 Marunouchi 2-chome, Chiyoda-ku Tokyo, 05, 〒1000005, JP)
International Classes:
C08G65/00; B32B15/08; B32B27/00; C08J5/24; C08K5/3415; C08L61/34
Domestic Patent References:
WO2014057973A12014-04-17
Foreign References:
JP2009001755A2009-01-08
CN103131007A2013-06-05
JP2004010839A2004-01-15
JP2017186265A2017-10-12
JP2009001783A2009-01-08
JP2018135447A2018-08-30
Attorney, Agent or Firm:
SHIN-EI PATENT FIRM, P.C. (Toranomon East Bldg. 8F, 7-13 Nishi-Shimbashi 1-chome, Minato-k, Tokyo 03, 〒1050003, JP)
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