CURABLE RESIN COMPOSITION

Title:

CURABLE RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2003/035755

Kind Code:

A1

Abstract:

A composition which can be easily prepared because of satisfactory handleability of the starting materials, has satisfactory transparency, and gives a cured article excellent in mechanical properties and adhesive properties. The curable resin composition comprises: (A) an oxyalkylene polymer having a silicon−containing functional group capable of being crosslinked through formation of a siloxane bond&semi (B) a copolymer which has a silicon−containing functional group capable of being crosslinked through formation of a siloxane bond and the molecular chain of which substantially comprises (b−1) monomer units derived from an alkyl (meth)acrylate in which the alkyl has one or two carbon atoms and (b−2) monomer units derived from an alkyl (meth)acrylate in which the alkyl has seven to nine carbon atoms&semi and (C) a curing accelerator.

Inventors:

UEDA KAZUHIKO (JP)
KOTANI JUN (JP)
KOMITSU SHINTARO (JP)
IWAKIRI HIROSHI (JP)

Application Number:

PCT/JP2002/010977

Publication Date:

May 01, 2003

Filing Date:

October 23, 2002

Export Citation:

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Assignee:

KANEKA CORP (JP)
UEDA KAZUHIKO (JP)
KOTANI JUN (JP)
KOMITSU SHINTARO (JP)
IWAKIRI HIROSHI (JP)

International Classes:

C08G65/26; C08G65/336; C08L71/02; C09D133/06; C09D143/04; C08L33/06; C08L43/04; (IPC1-7): C08L71/02; C08L33/06

Foreign References:

JP2001049113A	2001-02-20
EP0673972A1	1995-09-27
JPH06172631A	1994-06-21
JPH11335647A	1999-12-07
JPH04372683A	1992-12-25
JP2000136313A	2000-05-16
JP2002201350A	2002-07-19

Other References: