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Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2003/099929
Kind Code:
A1
Abstract:
A composition comprising as major components: a silylated urethane resin in which the main chain is a polyoxyalkylene polymer and the molecule has a reactive silicon group at an end and has a substituted urea bond therein; a diluent (B) having a boiling point of 250°C or higher; and a curing catalyst (C), wherein the curing catalyst (C) is a product of the reaction of a poly(dialkylstannoxane)dicarboxylate represented by the general formula (1) with a silicate compound represented by the general formula R3nSi(OR4)4-n (2).

Inventors:
SATO SHINICHI (JP)
INOUE AYAKO (JP)
MORI SHIGEKI (JP)
NOMURA YUKIHIRO (JP)
Application Number:
PCT/JP2003/006773
Publication Date:
December 04, 2003
Filing Date:
May 29, 2003
Export Citation:
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Assignee:
KONISHI CO LTD (JP)
SATO SHINICHI (JP)
INOUE AYAKO (JP)
MORI SHIGEKI (JP)
NOMURA YUKIHIRO (JP)
International Classes:
C08G18/10; C08G18/12; C08G18/24; C08G18/67; C08G18/80; C08G18/83; C09J175/08; (IPC1-7): C08L75/08; C08G18/83; C08G77/458; C08L57/00; C08L71/02; C08L85/00; C09J175/08
Foreign References:
JPH10168302A1998-06-23
JPH09234869A1997-09-09
Other References:
See also references of EP 1514903A4
Attorney, Agent or Firm:
Miyoshi, Hidekazu (2-8 Toranomon 1-chome, Minato-k, Tokyo 01, JP)
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