Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2007/119867
Kind Code:
A1
Abstract:
Disclosed is a curable resin composition containing an organic polymer having a reactive silicon group, which composition has excellent workability (thixotropy and coating workability) required for adhesives for floor coverings and the like without decreasing mechanical properties and the like. Specifically disclosed is a curable resin composition containing an organic polymer (A) having a reactive silicon group and a filler (B) which is obtained by combining a filler (B1) having an average particle diameter of less than 0.5 μm, a filler (B2) having an average particle diameter of not less than 0.5 μm but less than 10 μm, and a filler (B3) having an average particle diameter of not less than 10 μm.
Inventors:
INDESTEEGE JOHAN (BE)
VAN SANDE GUIDO (BE)
VAN SANDE GUIDO (BE)
Application Number:
PCT/JP2007/058470
Publication Date:
October 25, 2007
Filing Date:
April 18, 2007
Export Citation:
Assignee:
KANEKA CORP (JP)
INDESTEEGE JOHAN (BE)
VAN SANDE GUIDO (BE)
INDESTEEGE JOHAN (BE)
VAN SANDE GUIDO (BE)
International Classes:
C08L101/10; C08K3/26; C08L71/02; C09J11/04; C09J171/02; C09J201/10
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Other References:
See also references of EP 2011833A4
Attorney, Agent or Firm:
KANEKA CORPORATION (Kita-ku Osaka-sh, Osaka 88, JP)
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