Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2012/081705
Kind Code:
A1
Abstract:
Provided is a curable resin composition which can provide a cured article having a low dielectric constant and a low dielectric tangent, and can also provide a cured article having excellent moldability at ordinary press-molding temperatures, excellent heat resistance and excellent adhesion properties. The present invention provides a curable resin composition containing a polyphenylene ether, wherein the average number of phenolic hydroxy groups is 0.3 or more per molecule of the polyphenylene ether, the resin flow amount of the curable resin composition upon curing is 0.3 to 15% inclusive, and a cured article having a dielectric tangent of 0.005 or less at 1 GHz and a glass transition temperature of 170˚C or higher can be produced.
Inventors:
TOKIWA TETSUJI (JP)
UTSUMI TAKAMITSU (JP)
ENDO MASAAKI (JP)
UTSUMI TAKAMITSU (JP)
ENDO MASAAKI (JP)
Application Number:
PCT/JP2011/079229
Publication Date:
June 21, 2012
Filing Date:
December 16, 2011
Export Citation:
Assignee:
ASAHI KASEI E MATERIALS CORP (JP)
TOKIWA TETSUJI (JP)
UTSUMI TAKAMITSU (JP)
ENDO MASAAKI (JP)
TOKIWA TETSUJI (JP)
UTSUMI TAKAMITSU (JP)
ENDO MASAAKI (JP)
International Classes:
C08G65/48; B32B17/04; C08F2/44; C08F283/06; H05K1/03
Foreign References:
| JP2008260942A | 2008-10-30 | |||
| JP2005290124A | 2005-10-20 | |||
| JPH05179136A | 1993-07-20 | |||
| JPH0431464A | 1992-02-03 | |||
| JP2007030326A | 2007-02-08 | |||
| JPH02120357A | 1990-05-08 | |||
| JPH06207096A | 1994-07-26 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
Aoki 篤 (JP)
Aoki 篤 (JP)
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Claims: