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Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2013/031678
Kind Code:
A1
Abstract:
Provided is a curable resin composition exhibiting high adhesion durability. The curable resin composition contains: a (meth)acrylate oligomer (A) selected from the group consisting of urethane-based (meth)acrylate oligomers, polyester-based (meth)acrylate oligomers, polyether-based (meth)acrylate oligomers, epoxy-based (meth)acrylate oligomers, diene polymer-based (meth)acrylate oligomers, and oligomers having a backbone of the hydrogenated product of a diene polymer-based (meth)acrylate; a (meth)acrylate (B) exhibiting a homopolymer glass transition temperature of -100°C to 60°C; one or more compounds (C) having one mercapto group per molecule, the compound(s) being selected from the group consisting of alkanethiols and carboxythiols; and a photopolymerization initiator (D).

Inventors:
HISHA YUKI (JP)
HAYASHI YASUNORI (JP)
GOTO YOSHITSUGU (JP)
YODA KIMIHIKO (JP)
Application Number:
JP2012/071425
Publication Date:
March 07, 2013
Filing Date:
August 24, 2012
Export Citation:
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Assignee:
DENKI KAGAKU KOGYO KK (JP)
HISHA YUKI (JP)
HAYASHI YASUNORI (JP)
GOTO YOSHITSUGU (JP)
YODA KIMIHIKO (JP)
International Classes:
C08F290/06; B32B23/20; B32B27/00; B32B27/30; C09J4/02; C09J11/06; C09J175/14; C09J201/02
Domestic Patent References:
WO2011158840A12011-12-22
Foreign References:
JPH0859302A1996-03-05
JP2010254853A2010-11-11
JP2002525424A2002-08-13
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
SK patent business corporation (JP)
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Claims: