Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2014/103652
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing, as a material particularly suitable for the sealing of electric devices, a curable resin composition which can have excellent storage stability including a viscosity and fluidability properties upon the storage at room temperature or in a refrigerator while still keeping adhesion strength thereof. The present invention relates to a curable resin composition comprising the following components (A) to (C): (A) 100 parts by mass of an epoxy resin; (B) 0.01 to 5 parts by mass of a polycarboxylic acid hydrate; and (C) 1 to 50 parts by mass of a component capable of curing the epoxy resin.
Inventors:
KOJIMA KAZUHIRO (JP)
HA KHOI-NGUYEN (FR)
MORITOKI TATSUYA (JP)
HA KHOI-NGUYEN (FR)
MORITOKI TATSUYA (JP)
Application Number:
PCT/JP2013/082728
Publication Date:
July 03, 2014
Filing Date:
December 05, 2013
Export Citation:
Assignee:
THREE BOND CO LTD (JP)
International Classes:
C08L63/00; H01H50/02
Foreign References:
| JP2009019099A | 2009-01-29 | |||
| JP2005330315A | 2005-12-02 | |||
| JP2007316058A | 2007-12-06 | |||
| JPH10176032A | 1998-06-30 | |||
| JPH0892355A | 1996-04-09 | |||
| JPH08100047A | 1996-04-16 |
Attorney, Agent or Firm:
HAMADA Yuriko et al. (JP)
Yuriko Hamada (JP)
Yuriko Hamada (JP)
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