Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2014/141819
Kind Code:
A1
Abstract:
The purpose of the invention is to provide a curable resin composition having excellent heat resistance of the cured product. This curable resin composition contains a polysiloxane (A) having at least one (meth)acryloyl group in the molecule, and a silicone resin (B) represented by a specific average unit formula.
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Inventors:
ITO TSUBASA (JP)
ISHIKAWA KAZUNORI (JP)
ISHIKAWA KAZUNORI (JP)
Application Number:
PCT/JP2014/053648
Publication Date:
September 18, 2014
Filing Date:
February 17, 2014
Export Citation:
Assignee:
YOKOHAMA RUBBER CO LTD (JP)
International Classes:
C08F2/44; C08L83/04; C08L83/07
Foreign References:
JP2012082393A | 2012-04-26 | |||
JP2008156435A | 2008-07-10 | |||
JP2003192751A | 2003-07-09 | |||
JPH07258582A | 1995-10-09 |
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)
Mochitoshi Watanabe (JP)
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