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Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2015/129711
Kind Code:
A1
Abstract:
 The present invention relates to a curable resin composition that at least includes: (A) 100 parts by mass of a (meth)acrylic monomer having a C5-18 monofunctional chain-like alkyl backbone on the main chain thereof; (B) 15-45 parts by mass of a PTFE filler; (C) 0.01-5 parts by mass of a photoinitiator; and (D) 1-10 parts by mass of a thermoplastic elastomer. This curable resin composition has suitable workability and the desired thixotropy for use as a curable resin composition to be used in sealing applications such as formed in place gaskets.

Inventors:
KAMAKURA Hayato (1-1, Oyama-cho, Midori-ku, Sagamihara-sh, Kanagawa 46, 〒2520146, JP)
NAKAMURA Moeko (1-1, Oyama-cho, Midori-ku, Sagamihara-sh, Kanagawa 46, 〒2520146, JP)
Application Number:
JP2015/055303
Publication Date:
September 03, 2015
Filing Date:
February 24, 2015
Export Citation:
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Assignee:
THREEBOND FINE CHEMICAL CO., LTD. (1-1 Oyama-cho, Midori-ku Sagamihara-sh, Kanagawa 46, 〒2520146, JP)
International Classes:
C08F2/48; C08F2/44; C08F259/08; C08F291/00; C08L21/00; C08L27/18; C08L33/00
Domestic Patent References:
WO2013161402A12013-10-31
Foreign References:
JP2007169463A2007-07-05
JP2011052134A2011-03-17
JP2005302564A2005-10-27
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. et al. (Toranomon East Bldg. 10F, 7-13 Nishi-Shimbashi 1-chome, Minato-k, Tokyo 03, 〒1050003, JP)
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