Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2015/129711
Kind Code:
A1
Abstract:
The present invention relates to a curable resin composition that at least includes: (A) 100 parts by mass of a (meth)acrylic monomer having a C5-18 monofunctional chain-like alkyl backbone on the main chain thereof; (B) 15-45 parts by mass of a PTFE filler; (C) 0.01-5 parts by mass of a photoinitiator; and (D) 1-10 parts by mass of a thermoplastic elastomer. This curable resin composition has suitable workability and the desired thixotropy for use as a curable resin composition to be used in sealing applications such as formed in place gaskets.
Inventors:
KAMAKURA HAYATO (JP)
NAKAMURA MOEKO (JP)
NAKAMURA MOEKO (JP)
Application Number:
PCT/JP2015/055303
Publication Date:
September 03, 2015
Filing Date:
February 24, 2015
Export Citation:
Assignee:
THREEBOND FINE CHEMICAL CO LTD (JP)
International Classes:
C08F2/48; C08F2/44; C08F259/08; C08F291/00; C08L21/00; C08L27/18; C08L33/00
Domestic Patent References:
| WO2013161402A1 | 2013-10-31 |
Foreign References:
| JP2007169463A | 2007-07-05 | |||
| JP2011052134A | 2011-03-17 | |||
| JP2005302564A | 2005-10-27 |
Attorney, Agent or Firm:
Eikoh Patent Firm, P. C. et al. (JP)
Patent business corporation glory patent firm (JP)
Patent business corporation glory patent firm (JP)
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