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Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/217677
Kind Code:
A1
Abstract:
Provided are: a curable resin composition yielding a cured product that combines superior heat resistance and dielectric properties; the cured product thereof; and a prepreg, circuit board, build-up film semiconductor sealant, and semiconductor device combining these capabilities. The curable resin composition of the present invention is characterized by containing a maleimide (A) having an indane backbone, a compound (B) having an unsaturated-bond-containing substituent, and an epoxy resin (C).

Inventors:
SHIMONO TOMOHIRO (JP)
OKAMOTO TATSUYA (JP)
Application Number:
PCT/JP2020/006795
Publication Date:
October 29, 2020
Filing Date:
February 20, 2020
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G59/18; B32B15/08; B32B15/088; C08F222/40; C08J5/24; H01L23/29; H01L23/31; H05K1/03
Domestic Patent References:
WO1993012933A11993-07-08
Foreign References:
JP2009084391A2009-04-23
JPH0347814A1991-02-28
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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