CURABLE RESIN COMPOSITION

Title:

CURABLE RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2021/049390

Kind Code:

A1

Abstract:

The objective of the present invention is to provide a curable resin composition which has fast curability, high heat resistance, and excellent permeability.　The present invention comprises (A) a cyanate ester resin, (B) an epoxy resin, (C) a latent curing agent, and (D) an inorganic pigment containing at least one metal selected from among titanium, iron, copper, chromium, zirconium, calcium, manganese and zinc. The primary particle diameter of the inorganic pigment which is component (D), is preferably 5-150 nm, and it is preferable that the inorganic pigment, which is component (D), is used in an amount of 0.01-10 parts by mass with respect to 100 parts by mass of the total amount of (A) the cyanate ester resin and (B) the epoxy resin.

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Inventors:

OTA KEISUKE (JP)
HIRAYAMA KOHEI (JP)
YAMADA SHINSUKE (JP)
OGAWA RYO (JP)

Application Number:

PCT/JP2020/033291

Publication Date:

March 18, 2021

Filing Date:

September 02, 2020

Export Citation:

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Assignee:

ADEKA CORP (JP)

International Classes:

C08G59/40; C08G73/06; C08K3/013; C08L63/00; C08L79/04; H01L21/56; H01L23/29; H01L23/31

Domestic Patent References:

WO2005056676A1

2005-06-23

Foreign References:

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