Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/182495
Kind Code:
A1
Abstract:
[Problem] To provide a curable resin composition for black light shielding for an inkjet, the curable resin composition having excellent surface curability in addition to high light-shielding properties, exhibiting stable adhesion under high-temperature and high-humidity conditions, and yielding a cured coating film having high hardness after curing. [Solution] A curable resin composition containing (A) an epoxy compound, (B) an oxetane compound, (C) a photoacid generator, and (D) a black colorant, wherein the (A) epoxy compound contains (a) an alicyclic epoxy compound having an ester bond in each molecule and (b) an alicyclic epoxy compound not having an ester bond in each molecule in a mass ratio within a numerical range of 5:100-30:100. [Selected drawing] None
Inventors:
TAKASHIMA SHUHEI (JP)
ODAGIRI YUTO (JP)
ODAGIRI YUTO (JP)
Application Number:
PCT/JP2023/011812
Publication Date:
September 28, 2023
Filing Date:
March 24, 2023
Export Citation:
Assignee:
TAIYO HOLDINGS CO LTD (JP)
International Classes:
C08G59/20; B41J2/01; B41M5/00; C08K3/04; C08K5/1525; C08L63/00; C09D11/36
Domestic Patent References:
| WO2021049331A1 | 2021-03-18 | |||
| WO2022059395A1 | 2022-03-24 |
Foreign References:
| JP2008138113A | 2008-06-19 | |||
| JP2005194453A | 2005-07-21 | |||
| JP2000144043A | 2000-05-26 | |||
| JP2005264098A | 2005-09-29 | |||
| JP2014196475A | 2014-10-16 | |||
| JPH1161034A | 1999-03-05 |
Attorney, Agent or Firm:
ETOH Toshiaki et al. (JP)
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