Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/195462
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a curable resin composition that can be used as an adhesive that exhibits an excellent impact resistance, heat resistance, and water resistance. The present invention is a curable resin composition comprising an epoxy resin (A), a blocked urethane (B), and an amine-type latent curing agent (C). Using Mw for the weight-average molecular weight and Mn for the number-average molecular weight of the blocked urethane (B), Mw is 15,000-38,000 and Mw/Mn is 1.9-3.0. The epoxy resin (A) is preferably a bisphenol-type epoxy resin, and the blocked urethane (B) preferably contains an oxybutylene group-containing blocked urethane and an oxypropylene group-containing blocked urethane.
Inventors:
INADOME MASATO (JP)
Application Number:
PCT/JP2023/013920
Publication Date:
October 12, 2023
Filing Date:
April 04, 2023
Export Citation:
Assignee:
ADEKA CORP (JP)
International Classes:
C08G18/58; C08G18/80; C09J175/00
Domestic Patent References:
| WO2020218552A1 | 2020-10-29 | |||
| WO2016159223A1 | 2016-10-06 |
Foreign References:
| JP2020132833A | 2020-08-31 | |||
| JP2021008581A | 2021-01-28 | |||
| JP2001064344A | 2001-03-13 | |||
| JP2007023238A | 2007-02-01 | |||
| JP2001048948A | 2001-02-20 |
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
Download PDF:
Previous Patent: RUNNING FORM ANALYZING SYSTEM, PROGRAM, AND METHOD
Next Patent: CODE INFORMATION PRINTING SYSTEM, PRINTING CONTROL DEVICE, AND MEDIUM
Next Patent: CODE INFORMATION PRINTING SYSTEM, PRINTING CONTROL DEVICE, AND MEDIUM