Title:
CURABLE RESIN COMPOSITIONS
Document Type and Number:
WIPO Patent Application WO/2007/023669
Kind Code:
A1
Abstract:
[PROBLEMS] To provide curable resin compositions useful as one-part moisture-curable adhesives which exhibit cure rates higher than those of conventional elastomeric adhesives and are excellent in adhesiveness. [MEANS FOR SOLVING PROBLEMS] The problems can be solved by using as the base polymer a graft copolymer (A) having a so-called H-type structure constituted of one central chain (a flexible polymer segment resulting from an oligomer) and two end chains (vinyl polymer segments) and containing alkoxysilyl groups in an amount of 0.5% by mass or above in terms of Si and moisture-curing the graft copolymer with a curing catalyst (B). The graft copolymer (A) is preferably synthesized by subjecting a monomer mixture comprising (a) an oligomer having double bonds at both ends and a number-average molecular weight of 2000 to 30000, (b) a vinyl monomer, and (c) a chain transfer agent having a functional group to radical polymerization.
More Like This:
Inventors:
GONDOU MITSURU (JP)
YAMADA MASASHI (JP)
YAMADA MASASHI (JP)
Application Number:
PCT/JP2006/315651
Publication Date:
March 01, 2007
Filing Date:
August 08, 2006
Export Citation:
Assignee:
TOAGOSEI CO LTD (JP)
GONDOU MITSURU (JP)
YAMADA MASASHI (JP)
GONDOU MITSURU (JP)
YAMADA MASASHI (JP)
International Classes:
C08L101/10; C08F290/02; C09J201/10
Foreign References:
| JP2005105179A | 2005-04-21 | |||
| JP2005015512A | 2005-01-20 | |||
| JP2004143411A | 2004-05-20 |
Attorney, Agent or Firm:
IDE, Masatake et al. (9F Gobancho Grand Bldg., 3-1, Gobanch, Chiyoda-ku Tokyo 76, JP)
Download PDF: