Title:
CURABLE RESIN FILM AND FIRST PROTECTIVE FILM FORMING SHEET
Document Type and Number:
WIPO Patent Application WO/2017/078036
Kind Code:
A1
Abstract:
This curable resin film containing an epoxy-based thermosetting component having a weight-average molecular weight of 200-4000 is adhered to the surface (5a) of a semiconductor wafer (5) having a plurality of bumps (51) that have an average apex height (h1) of 50-400 μm, an average diameter of 60-500 μm, and an average pitch of 100-800 μm, and a first protective film (1a) is formed by heating and curing the curable resin film at 100-200°C for 0.5-3 hours. When a longitudinal section of the first protective film (1a) is observed with a scanning electron microscope, the relationship between the ratio (h3/h1), which is the ratio of the average thickness (h3) of the first protective film (1a) at the central position between the bumps (51) to the average apex height (h1) of the bumps (51), and the ratio (h2/h1), which is the ratio of the average thickness (h2) of the first protective film (1a) at the position touching the bumps (51) to the average apex height (h1) of the bumps (51), is represented by the following formula [{(h2/h1)-(h3/h1)}≤0.1].
Inventors:
YAMAGISHI MASANORI (JP)
SATO AKINORI (JP)
SATO AKINORI (JP)
Application Number:
PCT/JP2016/082505
Publication Date:
May 11, 2017
Filing Date:
November 02, 2016
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/60; C09J7/20; C09J7/25; C09J7/30; C09J7/38; C09J163/00; H01L21/301
Foreign References:
| JP2012244115A | 2012-12-10 | |||
| JP2012156330A | 2012-08-16 |
Other References:
See also references of EP 3352204A4
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
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