Title:
CURABLE RESIN FILM AND FIRST PROTECTIVE FILM FORMING SHEET
Document Type and Number:
WIPO Patent Application WO/2017/078055
Kind Code:
A1
Abstract:
This curable resin film is for forming a first protective film on the bump-equipped surface of a semiconductor wafer by adhering to the surface and being cured. The haze (h1) of the surface when the curable resin film is cured by being heated at 160°C for one hour does not exceed 50, or the haze (h2) of the surface when the curable resin film is cured by being exposed to an ultraviolet ray under the conditions of an illuminance of 230 mW/cm2 and a light quantity of 510 mJ/cm2 does not exceed 50. A first protective film forming sheet is provided with a first support sheet and is provided with the curable resin film on one surface of the first support sheet.
Inventors:
YAMAGISHI MASANORI (JP)
SATO AKINORI (JP)
SATO AKINORI (JP)
Application Number:
PCT/JP2016/082546
Publication Date:
May 11, 2017
Filing Date:
November 02, 2016
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/301; B32B27/00; B32B27/16; B32B27/20; C09J7/10; C09J11/00; C09J201/00; H01L21/60; H01L23/29; H01L23/31
Foreign References:
| JP5514376B1 | 2014-06-04 | |||
| JP2003206452A | 2003-07-22 | |||
| JP2006013452A | 2006-01-12 |
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Download PDF:
Previous Patent: COMPLEX COMPRISING RNAI MOLECULE AND N-ACETYLATED CHITOSAN
Next Patent: CURABLE RESIN FILM AND FIRST PROTECTIVE FILM FORMING SHEET
Next Patent: CURABLE RESIN FILM AND FIRST PROTECTIVE FILM FORMING SHEET