Title:
CURABLE RESIN FILM AND FIRST PROTECTIVE FILM FORMING SHEET
Document Type and Number:
WIPO Patent Application WO/2017/078056
Kind Code:
A1
Abstract:
This curable resin film is for forming a first protective film on the bump-equipped surface of a semiconductor wafer by adhering to said surface and being cured. The yellow index (YI1) when the curable resin film is cured by being heated at 160°C for one hour does not exceed 45, or the yellow index (YI2) when the curable resin film is cured by being exposed to an ultraviolet ray under the conditions of an illuminance of 230 mW/cm2 and a light quantity of 510 mJ/cm2 does not exceed 45. A first protective film forming sheet is provided with a first support sheet and is provided with the curable resin film on one surface of the first support sheet.
Inventors:
YAMAGISHI MASANORI (JP)
SATO AKINORI (JP)
SATO AKINORI (JP)
Application Number:
PCT/JP2016/082548
Publication Date:
May 11, 2017
Filing Date:
November 02, 2016
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/60; C09J7/00; C09J7/10; C09J7/35; C09J201/00; H01L21/304
Foreign References:
| JP2004087965A | 2004-03-18 | |||
| JP2013014643A | 2013-01-24 |
Other References:
See also references of EP 3373326A4
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
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