Title:
CURABLE RESIN
Document Type and Number:
WIPO Patent Application WO/2023/068204
Kind Code:
A1
Abstract:
A curable resin and a curable resin composition according to the present invention have satisfactory handleability in a low-temperature molten state and, after curing reaction, are excellent in terms of bonding strength and creep characteristics in high-temperature environments. Specifically, this curable resin includes a moisture-curable modified polyolefin (A) comprising a polyolefin (a) having a moisture-curable functional group grafted thereonto and comprises a resin component characterized by having a 190°C melt viscosity of 30,000 mPa·s or less, a softening point of 70-160°C, and a content of low-molecular-weight components extracted with acetone of 2.5 mass% or less.
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Inventors:
YOSHINO KENTO (JP)
SASAI TAMAYO (JP)
SASAI TAMAYO (JP)
Application Number:
PCT/JP2022/038431
Publication Date:
April 27, 2023
Filing Date:
October 14, 2022
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C08F8/00; C08F255/02; C09J123/26; C09J151/06
Domestic Patent References:
| WO2012124345A1 | 2012-09-20 |
Foreign References:
| JP2011012262A | 2011-01-20 | |||
| JP2013047342A | 2013-03-07 | |||
| JP2006348153A | 2006-12-28 | |||
| JP2013119583A | 2013-06-17 |
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