CURABLE SILICONE COMPOSITION, CURED OBJECT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE

Title:

CURABLE SILICONE COMPOSITION, CURED OBJECT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2015/119227

Kind Code:

A1

Abstract:

A curable silicone composition that includes (A) an organopolysiloxane that is represented by the average unit formula (R1 3SiO1/2)a(R2 2SiO2/2)b(R3SiO3/2)c (wherein R1 is an alkyl group, an alkenyl group, an aryl group, or an aralkyl group, R2 is an alkyl group or an alkenyl group, and R3 is an alkyl group, an aryl group, or an aralkyl group, provided that, per molecule, alkenyl groups comprise at least 0.5 mol% of R1-R3, at least one R3 is an aryl group or an aralkyl group, 0.01≤a≤0.5, 0.4≤b≤0.8, 0.01≤c≤0.5, and a+b+c=1), (B) an organopolysiloxane that is different from component (A), (C) an organopolysiloxane that has at least two silicon-atom-bonded hydrogen atoms per molecule, and (D) a catalyst for a hydrosilylation reaction. The present invention forms a cured object that has favorable dispersion properties as a phosphor, is high strength, and has gas barrier properties.

Inventors:

HAYASHI AKITO (JP)
NISHIJIMA KAZUHIRO (JP)
IIMURA TOMOHIRO (JP)
SUTO MICHITAKA (JP)
SAGAWA TAKASHI (JP)
KOBAYASHI AKIHIKO (JP)

Application Number:

PCT/JP2015/053316

Publication Date:

August 13, 2015

Filing Date:

January 30, 2015

Export Citation:

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Assignee:

DOW CORNING TORAY CO LTD (JP)

International Classes:

C08L83/07; C08L83/05; H01L23/29; H01L23/31

Foreign References:

JP2004143361A	2004-05-20
JP2005105217A	2005-04-21
JP2007131694A	2007-05-31
JP2008001828A	2008-01-10
JP2008050494A	2008-03-06

Other References: