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Title:
CURABLE SILICONE COMPOSITION, CURED OBJECT THEREFROM, AND METHOD FOR PRODUCING SAID CURED OBJECT
Document Type and Number:
WIPO Patent Application WO/2023/032734
Kind Code:
A1
Abstract:
[Problem] To provide a curable silicone composition which has satisfactory hot-melt properties and excellent melting properties and is hence excellent in terms of handleability and curability during encapsulation and which gives cured objects excellent in terms of mechanical strength and strength of bonding to substrates and is suitable for use as an encapsulating material for semiconductor devices. [Solution] A curable silicone composition characterized by comprising (A) a hot-melt MDT-type organopolysiloxane resin having a specific siloxane-unit ratio, (B) an organohydrogensiloxane compound, (C) a hydrosilylation catalyst, and (D) a functional inorganic filler, the content of which is 400-3,000 parts by mass per 100 parts by mass of the sum of (A) to (C) components, and by being solid at 25°C and having hot-melt properties at a temperature of 200°C or lower.

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Inventors:
YAMAZAKI RYOSUKE (JP)
HAYASHI MASAYUKI (JP)
MATSUSHIMA HIDENORI (JP)
OZAKI KOICHI (JP)
IMAIZUMI TORU (JP)
Application Number:
PCT/JP2022/031578
Publication Date:
March 09, 2023
Filing Date:
August 22, 2022
Export Citation:
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Assignee:
DOW TORAY CO LTD (JP)
International Classes:
C08L83/07; C08J5/00; C08K3/013; C08K5/544; C08L83/05; C08L91/06; H01L23/29; H01L23/31
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