Title:
CURABLE SILICONE COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/026754
Kind Code:
A1
Abstract:
This curable silicone composition is characterized by comprising at least (A) an organopolysiloxane having at least two alkenyl groups in each molecule thereof, (B) an organopolysiloxane having at least two hydrogen atoms bonded to a silicon atom in each molecule thereof, (C) a polyether-modified silicone comprising repeating units represented by the general formula and having a number-average molecular weight of 1000 to 100000, and (D) a hydrosilylation catalyst, the curable silicone composition whereby an optical semiconductor device can be formed having minimal contamination of a case during manufacturing of the optical semiconductor device, good efficiency of light extraction from a light-emitting element, and minimal color unevenness or chromaticity deviation. This optical semiconductor device is also characterized in that a light-emitting element is sealed or covered by a cured material of the composition, and by having minimal contamination of a case, good efficiency of light extraction, and minimal color unevenness or chromaticity deviation.
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Inventors:
IIMURA TOMOHIRO (JP)
NISHIJIMA KAZUHIRO (JP)
FURUKAWA HARUHIKO (JP)
NISHIJIMA KAZUHIRO (JP)
FURUKAWA HARUHIKO (JP)
Application Number:
PCT/JP2018/028078
Publication Date:
February 07, 2019
Filing Date:
July 26, 2018
Export Citation:
Assignee:
DOW CORNING TORAY CO LTD (JP)
International Classes:
C08L83/07; C08L83/05; C08L83/12; H01L23/29; H01L23/31; H01L33/56
Foreign References:
| KR20140074241A | 2014-06-17 | |||
| JPS497339B1 | 1974-02-20 | |||
| JPH09296045A | 1997-11-18 |
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