Title:
CURABLE SILICONE COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/026755
Kind Code:
A1
Abstract:
This curable silicone composition is characterized by comprising at least (A) an organopolysiloxane having at least two alkenyl groups in each molecule thereof, (B) an organopolysiloxane not having a polyether structure and having at least two hydrogen atoms bonded to a silicon atom in each molecule thereof, (C) a polyether-modified silicone having a siloxane dendron structure and a polyether structure, and (D) a hydrosilylation catalyst, the curable silicone composition whereby an optical semiconductor device can be formed having minimal contamination of a case during manufacturing of the optical semiconductor device, good efficiency of light extraction from a light-emitting element, and minimal color unevenness or chromaticity deviation. This optical semiconductor device is also characterized in that a light-emitting element is sealed or covered by a cured material of the composition, and by having minimal contamination of a case, good efficiency of light extraction, and minimal color unevenness or chromaticity deviation.
Inventors:
IIMURA TOMOHIRO (JP)
NISHIJIMA KAZUHIRO (JP)
INAGAKI SAWAKO (JP)
FURUKAWA HARUHIKO (JP)
NISHIJIMA KAZUHIRO (JP)
INAGAKI SAWAKO (JP)
FURUKAWA HARUHIKO (JP)
Application Number:
PCT/JP2018/028079
Publication Date:
February 07, 2019
Filing Date:
July 26, 2018
Export Citation:
Assignee:
DOW CORNING TORAY CO LTD (JP)
International Classes:
C08L83/07; C08L83/05; C08L83/12; H01L23/29; H01L23/31; H01L33/56
Foreign References:
JP2013256622A | 2013-12-26 | |||
JP2009510249A | 2009-03-12 | |||
JPH09255794A | 1997-09-30 | |||
JPH09255793A | 1997-09-30 | |||
JPH11193331A | 1999-07-21 | |||
JPS63227517A | 1988-09-21 | |||
JP2005206784A | 2005-08-04 |
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