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Title:
CURABLE SILICONE COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/026755
Kind Code:
A1
Abstract:
This curable silicone composition is characterized by comprising at least (A) an organopolysiloxane having at least two alkenyl groups in each molecule thereof, (B) an organopolysiloxane not having a polyether structure and having at least two hydrogen atoms bonded to a silicon atom in each molecule thereof, (C) a polyether-modified silicone having a siloxane dendron structure and a polyether structure, and (D) a hydrosilylation catalyst, the curable silicone composition whereby an optical semiconductor device can be formed having minimal contamination of a case during manufacturing of the optical semiconductor device, good efficiency of light extraction from a light-emitting element, and minimal color unevenness or chromaticity deviation. This optical semiconductor device is also characterized in that a light-emitting element is sealed or covered by a cured material of the composition, and by having minimal contamination of a case, good efficiency of light extraction, and minimal color unevenness or chromaticity deviation.

Inventors:
IIMURA, Tomohiro (2-2, Chigusakaigan, Ichihara-sh, Chiba 08, 〒2990108, JP)
NISHIJIMA, Kazuhiro (2-2, Chigusakaigan, Ichihara-sh, Chiba 08, 〒2990108, JP)
INAGAKI, Sawako (2-2, Chigusakaigan, Ichihara-sh, Chiba 08, 〒2990108, JP)
FURUKAWA, Haruhiko (2-2, Chigusakaigan, Ichihara-sh, Chiba 08, 〒2990108, JP)
Application Number:
JP2018/028079
Publication Date:
February 07, 2019
Filing Date:
July 26, 2018
Export Citation:
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Assignee:
DOW CORNING TORAY CO., LTD. (1-5-1, Otemachi Chiyoda-k, Tokyo 04, 〒1000004, JP)
International Classes:
C08L83/07; C08L83/05; C08L83/12; H01L23/29; H01L23/31; H01L33/56
Foreign References:
JP2013256622A2013-12-26
JP2009510249A2009-03-12
JPH09255794A1997-09-30
JPH09255793A1997-09-30
JPH11193331A1999-07-21
JPS63227517A1988-09-21
JP2005206784A2005-08-04
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