CURABLE SILICONE COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE

Title:

CURABLE SILICONE COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2019/078046

Kind Code:

A1

Abstract:

[Problem] To provide a curable silicone composition whereby an optical semiconductor device can be formed that has good efficiency of light extraction from a light-emitting element and a small rate of change, and an optical semiconductor device having good efficiency of light extraction from a light-emitting element and a small rate of change over time. [Solution] A curable silicone composition including at least: (A) an organopolysiloxane represented by an average composition formula and having at least two alkenyl groups in the molecule thereof; (B) an organopolysiloxane having at least two silicon-atom-bonded hydrogen atoms in the molecule thereof, at least 5 mol% of silicon-atom-bonded groups other than hydrogen atoms being aryl groups; (C) an organopolysiloxane represented by an average unit formula and having an alkenyl group, an aryl group, and an epoxy-containing organic group; and (D) a hydrosilylation catalyst.

Inventors:

IIMURA TOMOHIRO (JP)
NISHIJIMA KAZUHIRO (JP)
PARK YUNGJIN (KR)

Application Number:

PCT/JP2018/037485

Publication Date:

April 25, 2019

Filing Date:

October 05, 2018

Export Citation:

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Assignee:

DOW CORNING TORAY CO LTD (JP)
DOW SILICONES CORP (US)

International Classes:

C08L83/07; C08L83/05; H01L23/29; H01L23/31

Domestic Patent References:

WO2016136245A1

2016-09-01

Foreign References:

KR20150047361A	2015-05-04
JP2010001335A	2010-01-07
JP2017145358A	2017-08-24
JP2013117032A	2013-06-13
JP2017218474A	2017-12-14
JP2017200692A	2017-11-09
JP2007008996A	2007-01-18
JP2010001335A	2010-01-07

Other References: