Title:
CURABLE SILICONE GEL COMPOSITION AND SILICONE GEL CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2022/050103
Kind Code:
A1
Abstract:
A curable silicone gel composition including: (A) 100 parts by mass of a branched-chain organosiloxane that has a specific structure; (B) 0.1-50 parts by mass of a diorganopolysiloxane in which both molecular chain terminals are blocked with a diorganohydrogensiloxy group; (C) a platinum-based catalyst; (D) a phosphorous acid triester compound in an amount that is 3-15 molecules per one platinum atom in the (C) component, said phosphorous acid triester compound having a structure in which a chain alkyl group is bonded to an oxygen atom of phosphorous acid; (E) an organic peroxide for which the 10-hour half-life temperature is 120°C or greater, in an amount that is 5-50 times the amount of the (D) component; and (F) an oxidation inhibitor. This curable silicone gel composition demonstrates superior high-temperature storability and deep section curability.
Inventors:
ARAKI TADASHI (JP)
Application Number:
PCT/JP2021/030771
Publication Date:
March 10, 2022
Filing Date:
August 23, 2021
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08K3/11; C08K5/14; C08K5/524; C08L83/05
Domestic Patent References:
| WO2018056297A1 | 2018-03-29 | |||
| WO2021014970A1 | 2021-01-28 |
Foreign References:
| JP2006063142A | 2006-03-09 | |||
| JP2849027B2 | 1999-01-20 | |||
| JP4530147B2 | 2010-08-25 | |||
| EP2050768A1 | 2009-04-22 | |||
| US6706840B1 | 2004-03-16 | |||
| US4256616A | 1981-03-17 | |||
| US4329275A | 1982-05-11 | |||
| DE60316102T2 | 2008-06-05 | |||
| JP2018503709A | 2018-02-08 |
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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