Title:
CURABLE SILICONE RESIN COMPOSITION, CURED OBJECT OBTAINED THEREFROM, AND OPTICAL SEMICONDUCTOR DEVICE FORMED USING SAME
Document Type and Number:
WIPO Patent Application WO/2016/013421
Kind Code:
A1
Abstract:
This curable silicone resin composition is characterized by comprising component (A), which is a silicone resin containing hydrogen atoms each bonded to a silicon atom (SiH groups), component (B), which is a silicone resin containing vinyl groups each bonded to a silicon atom (Si-CH=CH2 groups), and component (C), which is a platinum catalyst. The composition is further characterized in that the total content of silanol groups (Si-OH groups) in components (A) and (B) is 0.5-5.0 mmol/g and the content of platinum atoms in component (C) is 0.003-3.0 mass ppm of the sum of components (A), (B), and (C). A cured object obtained by heating the composition is suitable for use as the encapsulating material of an optical semiconductor device.
Inventors:
KAWAI WATARU (JP)
AKIYAMA KATSUHIRO (JP)
MATSUNO YU (JP)
NAKATSUJI JUNYA (JP)
SEINO MAKOTO (JP)
AKIYAMA KATSUHIRO (JP)
MATSUNO YU (JP)
NAKATSUJI JUNYA (JP)
SEINO MAKOTO (JP)
Application Number:
PCT/JP2015/069877
Publication Date:
January 28, 2016
Filing Date:
July 10, 2015
Export Citation:
Assignee:
CENTRAL GLASS CO LTD (JP)
International Classes:
C08L83/05; C08L83/07; C09J183/05; C09J183/07; C09K3/10; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
| WO2014115742A1 | 2014-07-31 |
Foreign References:
| JP2012012524A | 2012-01-19 | |||
| JP2005325174A | 2005-11-24 | |||
| JP2006299099A | 2006-11-02 | |||
| JP2006213789A | 2006-08-17 | |||
| JP2008127517A | 2008-06-05 | |||
| JP2009114365A | 2009-05-28 |
Attorney, Agent or Firm:
KOBAYASHI, Hiromichi et al. (JP)
Hiromichi Kobayashi (JP)
Hiromichi Kobayashi (JP)
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