CURABLE SILICONE RESIN COMPOSITION, CURED PRODUCT OF SAME, AND OPTICAL SEMICONDUCTOR DEVICE USING SAID CURED PRODUCT

Title:

CURABLE SILICONE RESIN COMPOSITION, CURED PRODUCT OF SAME, AND OPTICAL SEMICONDUCTOR DEVICE USING SAID CURED PRODUCT

Document Type and Number:

WIPO Patent Application WO/2017/056913

Kind Code:

A1

Abstract:

This curable silicone resin composition contains at least a first silicone resin that is obtained by hydrolysis-polycondensation of a first alkoxysilane composition and has a mass average molecular weight of 3,800-20,000, a second silicone resin that has an Si-H group, and a hydrosilylation catalyst. The alkoxysilane composition at least contains various oxysilane compounds represented by general formulae (1)-(3). This curable silicone resin composition is capable of providing a sealing material for optical semiconductor devices, which does not contain air bubbles and is free from tackiness. R1Si(OR2)3 [1] R3 2Si(OR4)2 [2] CH2=CH-Si(OR5)3 [3]

Inventors:

MATSUNO YU (JP)
AKIYAMA KATSUHIRO (JP)
KAWAI WATARU (JP)
SEINO MAKOTO (JP)

Application Number:

PCT/JP2016/076543

Publication Date:

April 06, 2017

Filing Date:

September 09, 2016

Export Citation:

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Assignee:

CENTRAL GLASS CO LTD (JP)

International Classes:

C08L83/07; C08G77/20; C08L83/05; H01L23/29; H01L23/31

Domestic Patent References:

WO2013021717A1	2013-02-14
WO2011162294A1	2011-12-29

Foreign References:

JP2013253210A	2013-12-19
JP2014196462A	2014-10-16

Attorney, Agent or Firm:

KOBAYASHI, Hiromichi et al. (JP)

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